GALVANIC GILDING OF DETAILS

	Maximum dimensions: The maximum dimension of parts to be gilded is 120x40x15 cm.
	The parameters of the coat: the thickness of the coat – 01-10 µm, on the galvanic or chemical nickel subcoat (pure gold without additions).

Requirements:
Details to be gilded have to be made of copper, brass, aluminium, steel, stainless steel or silver.

CHEMICAL GILDING OF DETAILS

	The maximum dimensions: The maximum dimension of parts to be gilded is 40x40x15 cm.
	The parameters of the coat: Thickness of the coat – 0,05-0,1 µm, on the chemical nickel subcoat (pure gold without additions).

Requirements:
Details to be gilded have to be made of copper, brass, aluminium, steel, stainless steel or silver.

GILDING OF SMALL PARTS IN THE MORTAR

	The charge: The minimum charge to the smallest mortar amounts to approx. 10 g.
	The parameters of the coat: Thickness of the coat – 0,05-10 µm, on the nickel subcoat or without subcoat (“hard” gold – the addition of nickel).

Requirements:
Parts to be gilded have to be made of copper, brass, nickel, argentan, bronze, steel, or silver. The parts can not get stuck together during the gilding in the mortar.

GALVANIC GILDING OF EDGES OF PRINTED CIRCUITS

	Maximum dimensions: The Maximum length of the gilded edge – 52 cm.
	Parameters of the coat: Thickness of the coat – 0,1-8 µm, on the nickel subcoat or without subcoat (“hard” gold – the addition of nickel).

Requirements:
The highest quality (and appearance) of gilding can be obtained on the circuits without the tin-lead coat, with the anti-soldering layer.

GALVANIC GILDING OF SURFACES OF PRINTED CIRCUITS

	Maximum dimensions: The maximum dimension of parts to be gilded is 120×40 cm.
	The parameters of the coat: Thickness of the coat – 0,1-8 µm, on the nickel subcoat or without subcoat (“hard” gold – the addition of nickel).

Requirements:
The highest quality (and appearance) of gilding can be obtained on the circuits without the tin-lead coat, with the anti-soldering layer.

CHEMICAL GILDING OF PRINTED CIRCUITS

	Maximum dimensions: The maximum dimension of the circuit for chemical gilding is 40×35 cm.
	The parameters of the coat: Thickness of the coat – 0,05-0,1 µm, on the chemical nickel subcoat (pure gold without additions).

Requirements:
The circuits to be gilded cannot be covered by tin-lead coat. Not every anti-soldering layer stands the process of chemical gilding.